8.   PACKAGING OF THE L-17D

L-2010 die are packaged and sealed in ceramic packages to become L-17D parts.

The dies are bonded in accordance with HCI drawing 1610. Rev. C shown in Fig.11.

Fig. 12 is a print of the Kyocera 36-lead flat pack housing CFQP # PB-F86140-B-03 which is used.

After bonding, the housing is capped with a Williams Advanced Materials lid (Part # W269-010/1212-0021).  Fig. 13 is a print of this part.